{"id":32194,"date":"2018-12-17T15:35:21","date_gmt":"2018-12-17T15:35:21","guid":{"rendered":"\/forum\/forums\/topic\/how-to-parameterize-thermal-conductivity-of-a-material\/"},"modified":"2018-12-17T15:35:21","modified_gmt":"2018-12-17T15:35:21","slug":"how-to-parameterize-thermal-conductivity-of-a-material","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/how-to-parameterize-thermal-conductivity-of-a-material\/","title":{"rendered":"How to parameterize thermal conductivity of a material"},"content":{"rendered":"<p>Hi all,<\/p>\n<p><\/p>\n<p>I&#8217;m bit new to Ansys and wondering how to parameterize thermal conductivity of a material.<\/p>\n<p><\/p>\n<p>In our simplified model there are two objects in contact, say A (top object) and B (bottom bottom). All faces of the objects except contact faces and bottom surface of object A are exposed to stagnant air.<\/p>\n<p><\/p>\n<p>Material properties of object B remain same. A constant temperature is given to the bottom surface of the material A. A transient Ansys thermal model was already created for this.<\/p>\n<p><\/p>\n<p>In this instance, our idea is to vary the thermal conductivity of Object A and monitor the temperature of the top surface of object B. Based on this simulation we are expected to find a range of thermal conductivities that could justify materials for physical prototyping.<\/p>\n<p><\/p>\n<p>Any line of advice is highly appreciate.<\/p>\n","protected":false},"template":"","class_list":["post-32194","topic","type-topic","status-closed","hentry"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_bbp_old_topic_id":["4366"],"_bbp_old_topic_author_name_id":["Anonymous"],"_bbp_old_is_topic_anonymous_id":["false"],"_bbp_old_closed_status_id":["publish"],"_bbp_author_ip":[null],"_bbp_old_sticky_status_id":["normal"],"_bbp_likes_count":["0","0","0","0","0"],"_btv_view_count":["3265"],"_bbp_topic_status":["unanswered"],"_bbp_status":["publish"],"_bbp_topic_id":["32194"],"_bbp_forum_id":["27792"],"_bbp_engagement":["25","22555","161226"],"_bbp_voice_count":["3"],"_bbp_reply_count":["3"],"_bbp_last_reply_id":["73015"],"_bbp_last_active_id":["73015"],"_bbp_last_active_time":["2018-12-21 09:12:07"]},"test":"rwath"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/32194","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/32194\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=32194"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}