Good afternoon,<\/p>\n
As part of our Campus Solutions bundle, we have licence features for software called “RedHawk 3DX”. From guessing, we’ve chosen “RedHawk” as our software offering for our students\/subscribers. From searches dating back to 2012, “RedHawk 3DX” is a name for this tool: <\/p>\n
https:\/\/semiwiki.com\/eda\/ansys-inc\/1237-redhawk-on-to-the-future\/<\/p>\n
In our Ansys Semiconductor download section (Customer Portal), we can obtain copies of:<\/p>\n
RedHawk (no suffix)<\/p>\n
RedHawk utilities (not yet investigated)<\/p>\n
RedHawk SC-Electrothermal<\/p>\n
RedHawk-SC Electrothermal Solver<\/p>\n
… among many other programs. Our Synopsys university bundle includes the “3DIC Compiler” software, and other tools that fit together for a combined Synopsys-Ansys chiplet design flow. What we don’t have is a Synopsys licence feature for “RedHawk Analysis Fusion”, which we believe links Ansys RedHawk (SC?) directly to the Synopsys tools. <\/p>\n
Would you please let us know: <\/p>\n
If RedHawk 3DX would perform similar chiplet analyses in the combined Synopsys-Ansys design flow that RedHawk SC-Electrothermal does, per Synopsys documents? It is this particular tool name that is referenced; and<\/p>\n
Do you have an example using only the Ansys software that describers the import and set-up of a 2.5D\/3D chiplet from Synopsys software for analyses? <\/p>\n
<\/p>\n
Thank you, <\/p>\n
CMC Microsystems Technical Support Staff<\/p>\n
<\/p>\n
<\/p>\n
<\/p>\n","protected":false},"template":"","class_list":["post-315314","topic","type-topic","status-closed","hentry"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_oembed_203ee8e77d3e1e08aa1d337f3e73ad0b":["{{unknown}}"],"_bbp_subscription":["3940","49500"],"_bbp_author_ip":["23.52.43.81"]," _bbp_last_reply_id":["0"]," _bbp_likes_count":["0"],"_btv_view_count":["1166"],"_bbp_status":["publish"],"_bbp_topic_status":["unanswered"],"_bbp_topic_id":["315314"],"_bbp_forum_id":["27796"],"_bbp_engagement":["3940","49500"],"_bbp_voice_count":["2"],"_bbp_reply_count":["2"],"_bbp_last_reply_id":["317830"],"_bbp_last_active_id":["317830"],"_bbp_last_active_time":["2023-11-15 15:43:17"],"_oembed_f636b9cbb7a85b6cb0c2d6d804574a91":["{{unknown}}"]},"test":"greigp"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/315314","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/315314\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=315314"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}