{"id":31484,"date":"2018-11-13T10:25:02","date_gmt":"2018-11-13T10:25:02","guid":{"rendered":"\/forum\/forums\/topic\/stress-calculation-between-2-material\/"},"modified":"2018-11-13T10:25:02","modified_gmt":"2018-11-13T10:25:02","slug":"stress-calculation-between-2-material","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/stress-calculation-between-2-material\/","title":{"rendered":"Stress calculation between 2 Material"},"content":{"rendered":"<p>Hello,<\/p>\n<p><\/p>\n<p>I am new to&nbsp;Simulation and my task is to find the stress between Adhesive and Contact as shown in the Image(Stress Simulation _Adhesive and contact).<\/p>\n<p><\/p>\n<p>The adhesive is placed between Substrate and chip for isolation. But as the adhesive solidifies it deforms, deforming the contact. Thus, by simulation i would like to know the area with minimum stress.<\/p>\n<p><\/p>\n<p>Problem is in defining the Physics. Below is the Physics defination:&nbsp;<\/p>\n<p><\/p>\n<p>Location in Physics region as 8 volumes ( 6 Contacts and 2 Adhesive) [The image shows only one side of Construction]<\/p>\n<p><\/p>\n<p>Material for these volumes- One for Contacts and other for Adhesive<\/p>\n<p><\/p>\n<p>Physics options is program controlled and Solid thermal conditions, temperature is 22&deg;C<\/p>\n<p><\/p>\n<p>In Structural conditions, displacement for Adhesive is defined, normal to surface.<\/p>\n<p><\/p>\n<p>I have problem defining Interface conditions.<\/p>\n<p><\/p>\n<p>Is the definition appropriate? What kind of interface needs to be defined?<\/p>\n<p><\/p>\n<p>I thank in advance for your response and time.<\/p>\n","protected":false},"template":"","class_list":["post-31484","topic","type-topic","status-closed","hentry"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_bbp_old_topic_id":["3656"],"_bbp_old_topic_author_name_id":["Anonymous"],"_bbp_old_is_topic_anonymous_id":["false"],"_bbp_old_closed_status_id":["publish"],"_bbp_author_ip":[null],"_bbp_old_sticky_status_id":["normal"],"_bbp_likes_count":["0","0","0","0","0"],"_btv_view_count":["1044"],"_bbp_topic_status":["unanswered"],"_bbp_status":["publish"],"_bbp_topic_id":["31484"],"_bbp_forum_id":["27791"],"_bbp_engagement":["240","160327"],"_bbp_voice_count":["2"],"_bbp_reply_count":["9"],"_bbp_last_reply_id":["70402"],"_bbp_last_active_id":["70402"],"_bbp_last_active_time":["2018-11-25 16:08:25"]},"test":"deepsharma25"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/31484","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/31484\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=31484"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}