


{"id":314175,"date":"2023-10-31T15:49:08","date_gmt":"2023-10-31T15:49:08","guid":{"rendered":"\/forum\/forums\/topic\/temperature-profile-in-ded-simulation\/"},"modified":"2023-10-31T15:49:08","modified_gmt":"2023-10-31T15:49:08","slug":"temperature-profile-in-ded-simulation","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/temperature-profile-in-ded-simulation\/","title":{"rendered":"Temperature Profile in DED-Simulation"},"content":{"rendered":"<p>Hello,&nbsp;<\/p>\n<p>I am trying to use the DED process simulation in Ansys Mechanical to map the temperature profile in the part during the build process. Of particular interest is whether the previous layer is cold enough to place a new layer on top of it. However, I am surprised that no matter how many layers have already been placed, there is no heat building up in the part. The previous layer has alwas cooled down below 100&deg;C immediately (even without any interlayer cooling time [dwell]) . Only the last layer seems to cool down realistically. As you can tell from the picture below even the previosly deposited elementcluster cools down immediately (within less than 0,5 seconds). I doubt that this corresponds to the cooling process in reality.<\/p>\n<p>Therefore, my question is whether it is even possible with the DED simulation in Mechanical to map the temperature curve accurately enough to be able to decide at which layers a pause time (dwell) would be required?<\/p>\n<p><img decoding=\"async\" src=\"\/forum\/wp-content\/uploads\/sites\/2\/2023\/10\/31-10-2023-1698766270-Temprature.PNG\" alt=\"\"><\/p>\n<p>Thanks in advance<\/p>\n<p>Jonas<\/p>\n","protected":false},"template":"","class_list":["post-314175","topic","type-topic","status-closed","hentry"],"aioseo_notices":[],"aioseo_head":"\n\t\t<!-- All in One SEO 4.9.10 - aioseo.com -->\n\t<meta name=\"description\" content=\"Hello, I am trying to use the DED process simulation in Ansys Mechanical to map the temperature profile in the part during the build process. Of particular interest is whether the previous layer is cold enough to place a new layer on top of it. 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