{"id":312381,"date":"2023-10-19T16:56:50","date_gmt":"2023-10-19T16:56:50","guid":{"rendered":"\/forum\/?post_type=topic&#038;p=312381"},"modified":"2023-10-19T16:56:50","modified_gmt":"2023-10-19T16:56:50","slug":"inserting-contact-resistance-between-two-layers-of-different-material","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/inserting-contact-resistance-between-two-layers-of-different-material\/","title":{"rendered":"Inserting contact resistance between two layers of different material"},"content":{"rendered":"<p>I am simulating with Maxwell (DC conduction) how current is distributed through a structure of metal-semiconductor(Ge)-metal, like the one of the image. I would like to add a contact resistance between the metal layers and the semiconductor one, so I would like to know if there is a simple way of doing this, for example by asigning a resistance to that interface. At the moment I have only thought of adding another intermediate layer with a resistivity equivalent to this contact resistance. However, I want to try different geometries for the metal contact, for what this solution is not practical.<\/p>\n<p>&nbsp;<img loading=\"lazy\" decoding=\"async\" src=\"\/forum\/wp-content\/uploads\/sites\/2\/2023\/10\/19-10-2023-1697734379-mceclip1.png\" width=\"240\" height=\"203\"><\/p>\n<p>Thank you in advance \ud83d\ude42<\/p>\n","protected":false},"template":"","class_list":["post-312381","topic","type-topic","status-closed","hentry","topic-tag-AnsysMaxwellelectronics-1"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_bbp_author_ip":["23.206.193.59"],"_bbp_subscription":["34841","13923"],"_btv_view_count":["1296"],"_bbp_topic_status":["unanswered"],"_bbp_status":["publish"],"_bbp_topic_id":["312381"],"_bbp_forum_id":["27793"],"_bbp_engagement":["13923","34841"],"_bbp_voice_count":["2"],"_bbp_reply_count":["1"],"_bbp_last_reply_id":["312503"],"_bbp_last_active_id":["312503"],"_bbp_last_active_time":["2023-10-20 11:04:53"]},"test":"aitana-cano-perezupm-es"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/312381","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/312381\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=312381"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}