{"id":307417,"date":"2023-09-19T07:31:28","date_gmt":"2023-09-19T07:31:28","guid":{"rendered":"\/forum\/forums\/topic\/via-hole-creating\/"},"modified":"2023-09-19T07:31:28","modified_gmt":"2023-09-19T07:31:28","slug":"via-hole-creating","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/via-hole-creating\/","title":{"rendered":"Via hole creating"},"content":{"rendered":"<div>I have a question about creating a via hole<\/div>\n<div>I know that when I create a via hole, I need to create a cylinder and subtract it from the substrate.&nbsp; I&#8217;m designing a GCPW and I&#8217;m wondering if I should make the start of the cylinder overlap the commonGND, or if I should make it exactly like the start of the substrate and make it as tall as the substrate. In other words, should the height of the via be substrate + ground*2 (top and bottom) or should it be exactly the height of the substrate?<\/div>\n<div>And if I create a via hole and then specify a finite conductivity (set the material to cooper) and set the thickness, is this via a via hole that is air inside and copper by thickness?<\/div>\n<div>&nbsp;<\/div>\n<div>And when I create the via hole, what if I want to fill it with another material (ex. Polymer)?<\/div>\n","protected":false},"template":"","class_list":["post-307417","topic","type-topic","status-closed","hentry"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_bbp_subscription":["26404","16925"],"_bbp_author_ip":["168.143.243.14"]," _bbp_last_reply_id":["0"]," _bbp_likes_count":["0"],"_btv_view_count":["1212"],"_bbp_topic_status":["unanswered"],"_bbp_status":["publish"],"_bbp_topic_id":["307417"],"_bbp_forum_id":["27793"],"_bbp_engagement":["16925","26404"],"_bbp_voice_count":["2"],"_bbp_reply_count":["5"],"_bbp_last_reply_id":["308110"],"_bbp_last_active_id":["308110"],"_bbp_last_active_time":["2023-09-22 14:50:47"]},"test":"sehwa-jungcampus-tu-berlin-de"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/307417","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/307417\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=307417"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}