


{"id":304332,"date":"2023-08-31T10:18:54","date_gmt":"2023-08-31T10:18:54","guid":{"rendered":"\/forum\/forums\/topic\/thermal-setting-of-wall-boundary-conditions-in-fluent\/"},"modified":"2023-08-31T10:18:54","modified_gmt":"2023-08-31T10:18:54","slug":"thermal-setting-of-wall-boundary-conditions-in-fluent","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/thermal-setting-of-wall-boundary-conditions-in-fluent\/","title":{"rendered":"Thermal setting of wall boundary conditions in fluent"},"content":{"rendered":"<p>I have some doubts about the thermal boundary condition setting of wall recently. Although this may be a very simple theoretical problem, I still want to hear everyone&#8217;s opinions and answers on the thermal setting of wall in fluent. To facilitate the explanation of my question, I will use the following model for illustration. The picture is a model I took, where the red color is fluid a, the yellow color is solid device b with wall thickness of 3mm, the blue color is fluid c, and the green color is solid jacket d with wall thickness of 2.5mm. Now I want to calculate the temperature during fluid flow (maybe reverse or same direction), which requires considering the thermal boundary conditions of each layer of wall (wall of fluid a, wall of device b&#8230;). Obviously, this is too complex, and in order to reduce the number of grids and computational costs, I only want to keep fluid a. However, this has caused confusion when setting the boundary conditions for the wall of fluid a. How should the wall boundary setting of fluid a be considered? I currently want to set it to convection, is this reasonable? If it&#8217;s reasonable, how should I set the parameter of heat transfer coefficient, wall thickness, Free stream temperature etc. as shown in the following figure? This has really troubled me for a long time, please answer for me, thank you!!!<\/p>\n<p><img decoding=\"async\" src=\"\/forum\/wp-content\/uploads\/sites\/2\/2023\/08\/31-08-2023-1693476754-1693475546609.jpg\" alt=\"\"><img decoding=\"async\" src=\"\/forum\/wp-content\/uploads\/sites\/2\/2023\/08\/31-08-2023-1693476770-1693476665689.jpg\" alt=\"\"><\/p>\n","protected":false},"template":"","class_list":["post-304332","topic","type-topic","status-closed","hentry","topic-tag-fluent"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_bbp_subscription":["13905","199"],"_bbp_author_ip":["96.7.218.215"]," _bbp_last_reply_id":["0"]," _bbp_likes_count":["0"],"_btv_view_count":["3027"],"_bbp_topic_status":["unanswered"],"_bbp_status":["publish"],"_bbp_topic_id":["304332"],"_bbp_forum_id":["27796"],"_bbp_engagement":["199","13905"],"_bbp_voice_count":["2"],"_bbp_reply_count":["7"],"_bbp_last_reply_id":["304499"],"_bbp_last_active_id":["304499"],"_bbp_last_active_time":["2023-09-01 07:59:09"]},"test":"wuhaibin833outlook-com"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/304332","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/304332\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=304332"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}