Now that I’ve figured out how to do a convection model I wanted to learn if I can somehow use the RthJSP which is the thermal resistance from LED wafer to the solder point under the package. This seems to be the common way LED manufactures specify their thermal properties. Anyway when I was asking the LED vendor for more information on the package material they suggested using the RthJSP in icepak somehow. Perhaps appling the 10 K\/W RthJSP value to a point under the LED or on the PCB pad itself? Is there a way to specify this as a thermal source somehow or use it to connect the thermal source of the LED to the pad?<\/p>\n
Thank you<\/p>\n","protected":false},"template":"","class_list":["post-304235","topic","type-topic","status-closed","hentry","topic-tag-ansys-icepak"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_bbp_subscription":["292344","28969"],"_bbp_author_ip":["104.102.248.140"]," _bbp_last_reply_id":["0"]," _bbp_likes_count":["0"],"_btv_view_count":["1622"],"_bbp_topic_status":["unanswered"],"_bbp_status":["publish"],"_bbp_topic_id":["304235"],"_bbp_forum_id":["27793"],"_bbp_engagement":["28969","292344"],"_bbp_voice_count":["2"],"_bbp_reply_count":["6"],"_bbp_last_reply_id":["305391"],"_bbp_last_active_id":["305391"],"_bbp_last_active_time":["2023-09-07 20:34:32"]},"test":"steimle1gmail-com"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/304235","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/304235\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=304235"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}