{"id":28574,"date":"2018-01-16T19:51:57","date_gmt":"2018-01-16T19:51:57","guid":{"rendered":"\/forum\/forums\/topic\/transient-thermal-analysis-thermal-interface\/"},"modified":"2018-01-16T19:51:57","modified_gmt":"2018-01-16T19:51:57","slug":"transient-thermal-analysis-thermal-interface","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/transient-thermal-analysis-thermal-interface\/","title":{"rendered":"Transient thermal analysis &#8211; Thermal interface"},"content":{"rendered":"<p>Hello,<\/p>\n<p><\/p>\n<p>I am trying to simulate the temperature effect of two bonded bodies, each at different temperatures. Body 1 is at 20 degrees Celsius and Body 2 is at 100 degrees Celsius. Body 1 is the cavity with a hole in the middle where body 2 is assembled and bonded. I run the simulation for 480 seconds. The heat in the model is transferred by conduction. Convection is applied at the top surfaces of both bodies and the boundaries of body 1 that contains body 2. I have experimentally run also this arrangement, so I have points to validate the model.<\/p>\n<p><\/p>\n<p>The problem that I have with the simulation results is that the temperature in the boundary increases very rapidly and this does not correspond to the reality. I have attached an example.<\/p>\n<p><\/p>\n<p>Could you please advise?<\/p>\n<p><\/p>\n<p>Many thanks.<\/p>\n","protected":false},"template":"","class_list":["post-28574","topic","type-topic","status-closed","hentry"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_bbp_old_topic_id":["741"],"_bbp_old_topic_author_name_id":["Anonymous"],"_bbp_old_is_topic_anonymous_id":["false"],"_bbp_old_closed_status_id":["publish"],"_bbp_author_ip":[null],"_bbp_old_sticky_status_id":["normal"],"_bbp_likes_count":["0","0","0","0","0"],"_btv_view_count":["2613"],"_bbp_subscription":["235689"],"_bbp_topic_status":["unanswered"],"_bbp_status":["publish"],"_bbp_topic_id":["28574"],"_bbp_forum_id":["27792"],"_bbp_engagement":["14986","155615","156309"],"_bbp_voice_count":["3"],"_bbp_reply_count":["13"],"_bbp_last_reply_id":["58892"],"_bbp_last_active_id":["58892"],"_bbp_last_active_time":["2018-05-24 12:52:38"]},"test":"julb"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/28574","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/28574\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=28574"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}