{"id":281148,"date":"2023-04-25T16:43:50","date_gmt":"2023-04-25T16:43:50","guid":{"rendered":"\/forum\/forums\/topic\/via-pad-is-not-displayed\/"},"modified":"2023-06-28T08:59:19","modified_gmt":"2023-06-28T08:59:19","slug":"via-pad-is-not-displayed","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/via-pad-is-not-displayed\/","title":{"rendered":"Via Pad is not displayed"},"content":{"rendered":"<p>Hi,<\/p>\n<p>&nbsp;<\/p>\n<p>I created one simple via in 3D Layout. There are three signal layer; top, inner, and bottom layer. The via was created from top to bottom layer, but the pad looks missing in the layer &#8220;3&#8221;. I am seeing the Pads of Top and Bottom layer, but not in layer &#8220;3&#8221;. Is it really missing or is there an option to turn on the pad in the middle layer?<\/p>\n<p><img decoding=\"async\" src=\"\/forum\/wp-content\/uploads\/sites\/2\/2023\/04\/25-04-2023-1682440823-mceclip2.png\"><\/p>\n<p>Via info<\/p>\n<p><img decoding=\"async\" src=\"\/forum\/wp-content\/uploads\/sites\/2\/2023\/04\/25-04-2023-1682440703-mceclip1.png\"><\/p>\n<p>Stackup<\/p>\n<p><img decoding=\"async\" src=\"\/forum\/wp-content\/uploads\/sites\/2\/2023\/04\/25-04-2023-1682440675-mceclip0.png\"><\/p>\n<p>&nbsp;<\/p>\n","protected":false},"template":"","class_list":["post-281148","topic","type-topic","status-closed","hentry"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_bbp_subscription":["282492","16577","276424"],"_bbp_author_ip":["23.220.96.180"]," _bbp_last_reply_id":["0"]," _bbp_likes_count":["0"],"_btv_view_count":["1130"],"_bbp_status":["publish"],"_bbp_topic_status":["unanswered"],"_bbp_topic_id":["281148"],"_bbp_forum_id":["27793"],"_bbp_engagement":["16577","276424","282492"],"_bbp_voice_count":["3"],"_bbp_reply_count":["2"],"_bbp_last_reply_id":["287608"],"_bbp_last_active_id":["287608"],"_bbp_last_active_time":["2023-06-07 17:38:46"]},"test":"edward-suhmicrochip-com"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/281148","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/281148\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=281148"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}