{"id":251656,"date":"2023-02-27T08:25:13","date_gmt":"2023-02-27T08:25:13","guid":{"rendered":"\/forum\/forums\/topic\/pcb-trace-mapping-issue\/"},"modified":"2023-02-27T08:25:13","modified_gmt":"2023-02-27T08:25:13","slug":"pcb-trace-mapping-issue","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/pcb-trace-mapping-issue\/","title":{"rendered":"PCB trace mapping issue"},"content":{"rendered":"<p>Hello&nbsp;<\/p>\n<p>I am facing some issues during trace mapping:<\/p>\n<p>1\/ When I import the tgz file in SpaceClaim, I found that there is no solid 3D. The ECAD engineer told me that<br \/>there is no 3D geometry in tgz file (I am surprised). What setting should they do in order to include the 3D in tgz? (They are using Zuken)<\/p>\n<p>2\/ Based on the reason above, I tried to import only one solid body of PCB with stp format, is it OK if importing a stp 3D?<\/p>\n<p>3\/ After import the trace tgz file, ANSYS can identify 4 layers but with 0mm thickness as shown in Fig. 1, I input the thickness manually shown in Fig. 2 (total PCB thickness 1.6mm). I also generate 4 elements through the thickness<\/p>\n<p>4\/ After mapping, it seems not correct, the metal fraction is nearly 1 as shown in Fig. 3, it seems I lost the dielectric layers, the PCB stack up information is shown in Fig. 4. I made a section in the PCB as shown in Fig. 5. How should I build the 3D model based on this stack up information?<\/p>\n<p>5\/ In my understanding, the tgz should include 7 layers of the PCB stack up(ignore the solder mask layers Resist A and B), is it correct?<\/p>\n<p>Thank you very much for your feedback<\/p>\n<p><img decoding=\"async\" src=\"\/forum\/wp-content\/uploads\/sites\/2\/2023\/02\/27-02-2023-1677486052-mceclip0.png\"><\/p>\n<p><img decoding=\"async\" src=\"\/forum\/wp-content\/uploads\/sites\/2\/2023\/02\/27-02-2023-1677486151-mceclip1.png\"><\/p>\n<p><img decoding=\"async\" src=\"\/forum\/wp-content\/uploads\/sites\/2\/2023\/02\/27-02-2023-1677486134-mceclip2.png\"><\/p>\n<p>&nbsp;<\/p>\n<p>&nbsp;<\/p>\n","protected":false},"template":"","class_list":["post-251656","topic","type-topic","status-closed","hentry"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_bbp_subscription":["183572","58821","293255","23863"],"_bbp_author_ip":["23.192.164.14"]," _bbp_last_reply_id":["0"]," _bbp_likes_count":["0"],"_btv_view_count":["1270"],"_bbp_topic_status":["unanswered"],"_bbp_status":["publish"],"_bbp_topic_id":["251656"],"_bbp_forum_id":["27791"],"_bbp_engagement":["23863","58821","183572","293255"],"_bbp_voice_count":["4"],"_bbp_reply_count":["5"],"_bbp_last_reply_id":["308368"],"_bbp_last_active_id":["308368"],"_bbp_last_active_time":["2023-09-25 11:40:29"]},"test":"haiquan"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/251656","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/251656\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=251656"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}