{"id":249315,"date":"2023-02-10T03:23:59","date_gmt":"2023-02-10T03:23:59","guid":{"rendered":"\/forum\/forums\/topic\/using-t-shell-in-ls-dyna\/"},"modified":"2023-02-10T03:23:59","modified_gmt":"2023-02-10T03:23:59","slug":"using-t-shell-in-ls-dyna","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/using-t-shell-in-ls-dyna\/","title":{"rendered":"Using T-Shell in LS DYNA"},"content":{"rendered":"<p>I&#8217;m doing a simulation and I&#8217;m worried about modeling the display.<\/p>\n<p>The display has many layers that are very thin.<\/p>\n<p>Some layers are soft enough to consider thickness changes, so I don&#8217;t use shells (shells are ignoring thickness direction changes, as I know) , so I am modeling each layer as solid but I think it might be very inefficient.&nbsp; So what I read recently is t-shell and composite materials , can this help? Is there any documents or data I can get related to? And the printed circuit board (PCB) is also being modeled as a solid mesh, so I&#8217;m considering using t-shell for this as well.<\/p>\n<p>I am usually doing <span style=\"text-decoration: underline\">drop<\/span> or <span style=\"text-decoration: underline\">steel-ball drop<\/span> simulation.<\/p>\n<p>And I&#8217;m not looking for damage to the display itself, but I&#8217;m interested in damage to the components below the display.<\/p>\n<p>Apart from t-shell, please share if you have any good suggestions for this kind of modeling.<\/p>\n","protected":false},"template":"","class_list":["post-249315","topic","type-topic","status-closed","hentry"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_bbp_subscription":["57893","13468","181804"],"_bbp_author_ip":["23.56.168.190"]," _bbp_last_reply_id":["0"]," _bbp_likes_count":["0"],"_btv_view_count":["1085"],"_bbp_topic_status":["unanswered"],"_bbp_status":["publish"],"_bbp_topic_id":["249315"],"_bbp_forum_id":["27814"],"_bbp_engagement":["13468","57893","181804"],"_bbp_voice_count":["3"],"_bbp_reply_count":["2"],"_bbp_last_reply_id":["249466"],"_bbp_last_active_id":["249466"],"_bbp_last_active_time":["2023-02-11 00:52:36"]},"test":"bb123-kimsamsung-com"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/249315","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/249315\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=249315"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}