{"id":246762,"date":"2023-01-17T15:13:59","date_gmt":"2023-01-17T15:13:59","guid":{"rendered":"\/forum\/forums\/topic\/sips-modelling\/"},"modified":"2023-01-17T15:13:59","modified_gmt":"2023-01-17T15:13:59","slug":"sips-modelling","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/sips-modelling\/","title":{"rendered":"SIPs Modelling"},"content":{"rendered":"

Hello,<\/p>\n

I would be grateful if somebody can assist. <\/p>\n

Can anybody be kind enough and guide me on how to model Structural Insulated Panels (SIPs). SIPs is basically a sandwich panel with EPS infill foam between OSB facing boards. I appreciate any threads that lead to the topic. One particular concern in mind is how to model the EPS infill foam and bond it to the OSB facings.<\/p>\n

I need to create the panel from individual components and link them together to simulate the glue beween the foam (EPS or XPS) and the OSB face boards. These panels are normally integrated to form walls, roofs or floors. In order to improve their performance for bending, deflection etc., timber rebates are inserted at the panel joints. I don’t know which element would be suitable to use for the glue to transfer the shear and stressess between the faceboards and infil foam.<\/p>\n

 <\/p>\n

<\/span><\/p>\n

Thanks in advance and I look forward to your response.<\/p>\n","protected":false},"template":"","class_list":["post-246762","topic","type-topic","status-closed","hentry"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_bbp_subscription":["271752","58821"],"_bbp_author_ip":["23.192.164.18"]," _bbp_last_reply_id":["0"]," _bbp_likes_count":["0"],"_btv_view_count":["625"],"_bbp_topic_status":["unanswered"],"_bbp_status":["publish"],"_bbp_topic_id":["246762"],"_bbp_forum_id":["27791"],"_bbp_engagement":["58821","271752"],"_bbp_voice_count":["2"],"_bbp_reply_count":["2"],"_bbp_last_reply_id":["249167"],"_bbp_last_active_id":["249167"],"_bbp_last_active_time":["2023-02-08 21:38:55"]},"test":"a-mardansalford-ac-uk"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/246762","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/246762\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=246762"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}