


{"id":168464,"date":"2022-04-13T18:54:00","date_gmt":"2022-04-13T18:54:00","guid":{"rendered":"\/forum\/forums\/topic\/via-wizard-in-hfss-3d-layout\/"},"modified":"2022-04-19T09:47:02","modified_gmt":"2022-04-19T09:47:02","slug":"via-wizard-in-hfss-3d-layout","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/via-wizard-in-hfss-3d-layout\/","title":{"rendered":"Via Wizard in HFSS 3D layout"},"content":{"rendered":"<div class=\"Item-Body\">\n<div class=\"Message userContent\">\n<p>Hello team, <\/p>\n<p>I want to design a Differential Via in HFSS 3D layout, what are the best practices to design and optimize differential via. <\/p>\n<p>Any Video or material will be a great help.<\/p>\n<p>I want to design a four-layer board. Differential microstrip pair at the Top and Bottom layers and their Return-path at layers 2 and 3. Via transition from top to bottom layer.<\/p>\n<p>Thanks,<\/p>\n<p>Vivek<\/p>\n","protected":false},"template":"","class_list":["post-168464","topic","type-topic","status-closed","hentry"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_btv_view_count":["2461"],"_bbp_likes_count":["0"],"_bbp_subscription":["253475"],"_bbpmt_movedon":["2022-07-01 16:17:37"],"_bbpmt_movedfrom":["151970"],"_bbp_topic_status":["unanswered"],"_bbp_status":["publish"],"_bbp_topic_id":["168464"],"_bbp_forum_id":["27793"],"_bbp_engagement":["191","253475"],"_bbp_voice_count":["2"],"_bbp_reply_count":["1"],"_bbp_last_reply_id":["211728"],"_bbp_last_active_id":["211728"],"_bbp_last_active_time":["2022-04-19 09:47:02"]},"test":"vivek-kamblecolorado-edu"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/168464","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/168464\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=168464"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}