{"id":165285,"date":"2022-01-05T02:38:07","date_gmt":"2022-01-05T02:38:07","guid":{"rendered":"\/forum\/forums\/topic\/is-it-possible-to-design-the-compound-semiconductor-with-the-spaceclaim\/"},"modified":"2022-01-05T02:38:07","modified_gmt":"2022-01-05T02:38:07","slug":"is-it-possible-to-design-the-compound-semiconductor-with-the-spaceclaim","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/is-it-possible-to-design-the-compound-semiconductor-with-the-spaceclaim\/","title":{"rendered":"is it possible to design the compound semiconductor with the Spaceclaim?"},"content":{"rendered":"<div class=\"Item-Body\">\n<div class=\"Message userContent\">\n<p>Hi,<\/p>\n<p>I&#039;m new in Ansys program. I&#039;ve heard that it is possible to simulate thermal analysis with Ansys Workbench.<\/p>\n<p>i have 2D designs for HEMTs(High electron mobility transistor) and MOSFETs.<\/p>\n<p>When i fabricated AlGaN\/GaN HEMT in person, i used ohmic metal Ti\/Al\/Ni\/Au. I wonder when i convert 2D designs to 3D designs with Ansys spaceclaim, Do i have to make ohmic metal each layer? for example first layer for Ti, second layer for Al, etc..<\/p>\n<p>Also, i wonder it is possible to designate the polarization for creating 2DEG(2-Dimension Electron Gas)<\/p>\n<p><\/p>\n<\/p>\n<p>plz, Help me if there is somebody who has experienced to design compound semiconductor to thermal analysis with workbench<\/p>\n<p><\/p>\n<\/p>\n<p>i need your help<\/p>\n<p><\/p>\n<\/p>\n<p>best regard,<\/p>\n<p>Hailey<\/p>\n","protected":false},"template":"","class_list":["post-165285","topic","type-topic","status-closed","hentry","topic-tag-ansys-spaceclaim","topic-tag-compoundsemiconductor-1","topic-tag-metal"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_bbp_author_ip":[""],"_bbp_view_count":["3481"],"_bbp_likes_count":["0","0"],"_bbp_forum_subforum_count":["0"],"_btv_view_count":["519"],"_bbp_subscription":["244854","81"],"_bbpmt_movedon":["2022-07-01 16:34:44"],"_bbpmt_movedfrom":["151970"],"_bbp_topic_status":["unanswered"],"_bbp_status":["publish"],"_bbp_topic_id":["165285"],"_bbp_forum_id":["27793"],"_bbp_engagement":["81","224867"],"_bbp_voice_count":["2"],"_bbp_reply_count":["1"],"_bbp_last_reply_id":["221019"],"_bbp_last_active_id":["221019"],"_bbp_last_active_time":["2022-07-26 18:45:17"]},"test":"hyeonjiii-kim95g-hongik-ac-kr"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/165285","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/165285\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=165285"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}