{"id":159903,"date":"2021-06-28T05:19:29","date_gmt":"2021-06-28T05:19:29","guid":{"rendered":"\/forum\/forums\/topic\/modelling-pcb-warpage-in-ansys-spaceclaim-and-mechanical\/"},"modified":"2021-06-30T09:14:58","modified_gmt":"2021-06-30T09:14:58","slug":"modelling-pcb-warpage-in-ansys-spaceclaim-and-mechanical","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/modelling-pcb-warpage-in-ansys-spaceclaim-and-mechanical\/","title":{"rendered":"Modelling PCB warpage in Ansys Spaceclaim and Mechanical"},"content":{"rendered":"
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My analysis needs to focus on the layer level (~10^-6) scale, for example, how a layer of copper, dielectric, or solder mask contributes to the overall bending (thermal strain) of the board in a reflow oven. <\/p>\n

Since a PCB model usually contains very intricated designs, modelling each layer of the PCB as 3D solids is going to be computationally expensive and will result in huge mesh element count. The approach I have in mind is modelling each layer as a 2D surface (or shell? Not really sure how the two are different) in Spaceclaim first, then in Mechanical specify the geometry thickness. Would this allow me to simulate PCB warpage in the out of plane direction as well?<\/p>\n

Please let me know if this approach is conceptually correct or could be improved in any way. Thank you very much.<\/p>\n

Side note: I am aware that Ansys has a feature called trace mapping, however, I've been having troubles to import layer stackup information into Mechanical properly. So I am wondering if there is any other workaround for now.<\/p>\n","protected":false},"template":"","class_list":["post-159903","topic","type-topic","status-closed","hentry","topic-tag-mechanical","topic-tag-pcb-manfacturing-2","topic-tag-shell-elements","topic-tag-spaceclaim","topic-tag-thermal-stress-1"],"aioseo_notices":[],"aioseo_head":"\n\t\t\n\t\n\t\n\t\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t