{"id":368490,"date":"2024-05-24T11:24:53","date_gmt":"2024-05-24T11:24:53","guid":{"rendered":"\/forum\/forums\/reply\/368490\/"},"modified":"2024-05-24T11:32:28","modified_gmt":"2024-05-24T11:32:28","slug":"368490","status":"publish","type":"reply","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/reply\/368490\/","title":{"rendered":"Reply To: FDTD Model for Interconnect Element"},"content":{"rendered":"<p>&lt;p&gt;&nbsp;&lt;\/p&gt;&lt;p&gt;Thank you G. Wang for reply.&lt;\/p&gt;&lt;p&gt;There is no direct application as such.&lt;\/p&gt;&lt;p&gt;&nbsp;&lt;\/p&gt;<\/p>\n","protected":false},"template":"","class_list":["post-368490","reply","type-reply","status-publish","hentry"],"aioseo_notices":[],"acf":[],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/replies\/368490","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/replies"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/reply"}],"version-history":[{"count":2,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/replies\/368490\/revisions"}],"predecessor-version":[{"id":368494,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/replies\/368490\/revisions\/368494"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=368490"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}