{"id":310483,"date":"2023-10-07T07:04:36","date_gmt":"2023-10-07T07:04:36","guid":{"rendered":"\/forum\/forums\/reply\/310483\/"},"modified":"2023-10-07T07:04:36","modified_gmt":"2023-10-07T07:04:36","slug":"310483","status":"publish","type":"reply","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/reply\/310483\/","title":{"rendered":"Reply To: Modal Analysis of PCB Board with components"},"content":{"rendered":"<p>&lt;p&gt;Thank you for your reply, I am actually asking about the pcb components properties&#8230; as you know PCB components consider any IC eg BGA now this will be modelled as just one block and to define properties of this component what should we consider like outer package that is encapsulation or inside chip material like silicon or etc&#8230;&lt;\/p&gt;&lt;p&gt;For reference consider Sherlock how does it specify any component properties whether it consider the outer package or inside material?&lt;\/p&gt;<\/p>\n","protected":false},"template":"","class_list":["post-310483","reply","type-reply","status-publish","hentry"],"aioseo_notices":[],"aioseo_head":"\n\t\t<!-- All in One SEO 4.9.10 - aioseo.com -->\n\t<meta name=\"description\" content=\"Thank you for your reply, I am actually asking about the pcb components properties... as you know PCB components consider any IC eg BGA now this will be modelled as just one block and to define properties of this component what should we consider like outer package that is encapsulation or inside chip material like\" \/>\n\t<meta name=\"robots\" content=\"max-image-preview:large\" \/>\n\t<link rel=\"canonical\" href=\"https:\/\/innovationspace.ansys.com\/forum\/forums\/reply\/310483\/\" \/>\n\t<meta name=\"generator\" content=\"All in One SEO (AIOSEO) 4.9.10\" \/>\n\t\t<meta property=\"og:locale\" content=\"en_US\" \/>\n\t\t<meta property=\"og:site_name\" content=\"Ansys Learning Forum | Ansys Innovation Space\" \/>\n\t\t<meta 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class=\"aioseo-schema\">\n\t\t\t{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/innovationspace.ansys.com\\\/forum\\\/forums\\\/reply\\\/310483\\\/#breadcrumblist\",\"itemListElement\":[{\"@type\":\"ListItem\",\"@id\":\"https:\\\/\\\/innovationspace.ansys.com\\\/forum#listItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/innovationspace.ansys.com\\\/forum\",\"nextItem\":{\"@type\":\"ListItem\",\"@id\":\"https:\\\/\\\/innovationspace.ansys.com\\\/forum\\\/forums\\\/reply\\\/310483\\\/#listItem\",\"name\":\"Reply To: Modal Analysis of PCB Board with components\"}},{\"@type\":\"ListItem\",\"@id\":\"https:\\\/\\\/innovationspace.ansys.com\\\/forum\\\/forums\\\/reply\\\/310483\\\/#listItem\",\"position\":2,\"name\":\"Reply To: Modal Analysis of PCB Board with components\",\"previousItem\":{\"@type\":\"ListItem\",\"@id\":\"https:\\\/\\\/innovationspace.ansys.com\\\/forum#listItem\",\"name\":\"Home\"}}]},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/innovationspace.ansys.com\\\/forum\\\/#organization\",\"name\":\"Ansys Learning Forum\",\"description\":\"Ansys Innovation Space\",\"url\":\"https:\\\/\\\/innovationspace.ansys.com\\\/forum\\\/\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/innovationspace.ansys.com\\\/forum\\\/forums\\\/reply\\\/310483\\\/#webpage\",\"url\":\"https:\\\/\\\/innovationspace.ansys.com\\\/forum\\\/forums\\\/reply\\\/310483\\\/\",\"name\":\"Reply To: Modal Analysis of PCB Board with components | Ansys Learning Forum\",\"description\":\"Thank you for your reply, I am actually asking about the pcb components properties... as you know PCB components consider any IC eg BGA now this will be modelled as just one block and to define properties of this component what should we consider like outer package that is encapsulation or inside chip material like\",\"inLanguage\":\"en-US\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/innovationspace.ansys.com\\\/forum\\\/#website\"},\"breadcrumb\":{\"@id\":\"https:\\\/\\\/innovationspace.ansys.com\\\/forum\\\/forums\\\/reply\\\/310483\\\/#breadcrumblist\"},\"datePublished\":\"2023-10-07T07:04:36+00:00\",\"dateModified\":\"2023-10-07T07:04:36+00:00\"},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/innovationspace.ansys.com\\\/forum\\\/#website\",\"url\":\"https:\\\/\\\/innovationspace.ansys.com\\\/forum\\\/\",\"name\":\"Ansys Learning Forum\",\"description\":\"Ansys Innovation Space\",\"inLanguage\":\"en-US\",\"publisher\":{\"@id\":\"https:\\\/\\\/innovationspace.ansys.com\\\/forum\\\/#organization\"}}]}\n\t\t<\/script>\n\t\t<!-- All in One SEO -->\n\n","aioseo_head_json":{"title":"Reply To: Modal Analysis of PCB Board with components | Ansys Learning Forum","description":"Thank you for your reply, I am actually asking about the pcb components properties... as you know PCB components consider any IC eg BGA now this will be modelled as just one block and to define properties of this component what should we consider like outer package that is encapsulation or inside chip material like","canonical_url":"https:\/\/innovationspace.ansys.com\/forum\/forums\/reply\/310483\/","robots":"max-image-preview:large","keywords":"","webmasterTools":{"miscellaneous":""},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"BreadcrumbList","@id":"https:\/\/innovationspace.ansys.com\/forum\/forums\/reply\/310483\/#breadcrumblist","itemListElement":[{"@type":"ListItem","@id":"https:\/\/innovationspace.ansys.com\/forum#listItem","position":1,"name":"Home","item":"https:\/\/innovationspace.ansys.com\/forum","nextItem":{"@type":"ListItem","@id":"https:\/\/innovationspace.ansys.com\/forum\/forums\/reply\/310483\/#listItem","name":"Reply To: Modal Analysis of PCB Board with components"}},{"@type":"ListItem","@id":"https:\/\/innovationspace.ansys.com\/forum\/forums\/reply\/310483\/#listItem","position":2,"name":"Reply To: Modal Analysis of PCB Board with components","previousItem":{"@type":"ListItem","@id":"https:\/\/innovationspace.ansys.com\/forum#listItem","name":"Home"}}]},{"@type":"Organization","@id":"https:\/\/innovationspace.ansys.com\/forum\/#organization","name":"Ansys Learning Forum","description":"Ansys Innovation Space","url":"https:\/\/innovationspace.ansys.com\/forum\/"},{"@type":"WebPage","@id":"https:\/\/innovationspace.ansys.com\/forum\/forums\/reply\/310483\/#webpage","url":"https:\/\/innovationspace.ansys.com\/forum\/forums\/reply\/310483\/","name":"Reply To: Modal Analysis of PCB Board with components | Ansys Learning Forum","description":"Thank you for your reply, I am actually asking about the pcb components properties... as you know PCB components consider any IC eg BGA now this will be modelled as just one block and to define properties of this component what should we consider like outer package that is encapsulation or inside chip material like","inLanguage":"en-US","isPartOf":{"@id":"https:\/\/innovationspace.ansys.com\/forum\/#website"},"breadcrumb":{"@id":"https:\/\/innovationspace.ansys.com\/forum\/forums\/reply\/310483\/#breadcrumblist"},"datePublished":"2023-10-07T07:04:36+00:00","dateModified":"2023-10-07T07:04:36+00:00"},{"@type":"WebSite","@id":"https:\/\/innovationspace.ansys.com\/forum\/#website","url":"https:\/\/innovationspace.ansys.com\/forum\/","name":"Ansys Learning Forum","description":"Ansys Innovation Space","inLanguage":"en-US","publisher":{"@id":"https:\/\/innovationspace.ansys.com\/forum\/#organization"}}]},"og:locale":"en_US","og:site_name":"Ansys Learning Forum | Ansys Innovation Space","og:type":"article","og:title":"Reply To: Modal Analysis of PCB Board with components | Ansys Learning Forum","og:description":"Thank you for your reply, I am actually asking about the pcb components properties... as you know PCB components consider any IC eg BGA now this will be modelled as just one block and to define properties of this component what should we consider like outer package that is encapsulation or inside chip material like","og:url":"https:\/\/innovationspace.ansys.com\/forum\/forums\/reply\/310483\/","article:published_time":"2023-10-07T07:04:36+00:00","article:modified_time":"2023-10-07T07:04:36+00:00","twitter:card":"summary_large_image","twitter:title":"Reply To: Modal Analysis of PCB Board with components | Ansys Learning Forum","twitter:description":"Thank you for your reply, I am actually asking about the pcb components properties... as you know PCB components consider any IC eg BGA now this will be modelled as just one block and to define properties of this component what should we consider like outer package that is encapsulation or inside chip material like"},"aioseo_meta_data":{"post_id":"310483","title":null,"description":null,"keywords":null,"keyphrases":null,"primary_term":null,"canonical_url":null,"og_title":null,"og_description":null,"og_object_type":"default","og_image_type":"content","og_image_url":null,"og_image_width":null,"og_image_height":null,"og_image_custom_url":null,"og_image_custom_fields":null,"og_video":null,"og_custom_url":null,"og_article_section":null,"og_article_tags":null,"twitter_use_og":true,"twitter_card":"default","twitter_image_type":"default","twitter_image_url":null,"twitter_image_custom_url":null,"twitter_image_custom_fields":null,"twitter_title":null,"twitter_description":null,"schema":{"blockGraphs":[],"customGraphs":[],"default":{"data":{"Article":[],"Course":[],"Dataset":[],"FAQPage":[],"Movie":[],"Person":[],"Product":[],"ProductReview":[],"Car":[],"Recipe":[],"Service":[],"SoftwareApplication":[],"WebPage":[]},"graphName":"","isEnabled":true},"graphs":[]},"schema_type":"default","schema_type_options":null,"pillar_content":false,"robots_default":true,"robots_noindex":false,"robots_noarchive":false,"robots_nosnippet":false,"robots_nofollow":false,"robots_noimageindex":false,"robots_noodp":false,"robots_notranslate":false,"robots_max_snippet":null,"robots_max_videopreview":null,"robots_max_imagepreview":"large","priority":null,"frequency":null,"local_seo":null,"limit_modified_date":false,"created":"2024-10-28 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