{"id":195165,"date":"2021-10-26T12:20:33","date_gmt":"2021-10-26T12:20:33","guid":{"rendered":"\/forum\/forums\/reply\/195165\/"},"modified":"2021-10-26T12:20:33","modified_gmt":"2021-10-26T12:20:33","slug":"195165","status":"publish","type":"reply","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/reply\/195165\/","title":{"rendered":"Reply To: Ansys Sherlock Constraints"},"content":{"rendered":"<p>Hi David<br \/>\n<br \/>\nThank you for your response &#8211; <br \/>\nThe area of most interest to me was thermal cycling (manifesting as mechanical stress on components with different CTE&#8217;s).<br \/>\nI aim to build a thermal profile using AEDT to serve as an input for sherlock. This would generate the expected service temperatures at low and high load operating points for the PCB.<br \/>\nThe output of this (I was hoping) would be a reliability score based on the thermal load profile, which I could test and validate (ie cycle the PCB til failure and compare predicted cycles against real cycles)<br \/>\nFrom Studying the theory documentation, it appears it looks at the temperature delta in the thermal profile, and computes based off this and the ECAD data\/component library. It looks in 2021 R2 that a reliability score has been withdrawn when looking just at therm\/mechanical loading &#8211; the documentation suggests the user can interpret the strain output for further reliability studies.<br \/>\nDo you have any suggestions on how to proceed? I am keen to keep the scope to just thermal cycling on the PCB, and really require a means of modelling predicted cycles to failure. At a stab, I presume I could look at the reported strain from each component in sherlock, assume bulk material properties at each interface, and put on a SN curve and indicate cycles til failure that way?<br \/>\n<img loading=\"lazy\" decoding=\"async\" src=\"\/forum\/wp-content\/uploads\/forum-uploads\/787\/MSQ6TCS6VC1N.png\" width=\"1574\" height=\"335\" \/><br \/>\n<img loading=\"lazy\" decoding=\"async\" src=\"\/forum\/wp-content\/uploads\/forum-uploads\/291\/3MA74QXDELZS.png\" width=\"452\" height=\"175\" \/><br \/>\n(the component data is taken from the example ODB++ -)<br \/>\nKind Regards<\/p>\n<p>Toby<\/p>\n","protected":false},"template":"","class_list":["post-195165","reply","type-reply","status-publish","hentry"],"aioseo_notices":[],"aioseo_head":"\n\t\t<!-- All in One SEO 4.9.10 - aioseo.com -->\n\t<meta name=\"description\" content=\"Hi David Thank you for your response - The area of most interest to me was thermal cycling (manifesting as mechanical stress on components with different CTE&#039;s). 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