


{"id":186242,"date":"2021-07-29T15:51:07","date_gmt":"2021-07-29T15:51:07","guid":{"rendered":"\/forum\/forums\/reply\/186242\/"},"modified":"2021-07-29T15:51:07","modified_gmt":"2021-07-29T15:51:07","slug":"186242","status":"publish","type":"reply","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/reply\/186242\/","title":{"rendered":"Reply To: How to realistically model PCB warpage?"},"content":{"rendered":"<p>To get a different solution you need to have a property that produces nonrecoverable strain such as plasticity or creep.  It might also be possible to model the reflow condition with the &#8220;Birth and Death&#8221; feature by &#8220;killing&#8221; the solder material at high temperature.  <\/p>\n","protected":false},"template":"","class_list":["post-186242","reply","type-reply","status-publish","hentry"],"aioseo_notices":[],"aioseo_head":"\n\t\t<!-- All in One SEO 4.9.10 - aioseo.com -->\n\t<meta name=\"description\" content=\"To get a different solution you need to have a property that produces nonrecoverable strain such as plasticity or creep. It might also be possible to model the reflow condition with the &quot;Birth and Death&quot; feature by &quot;killing&quot; the solder material at high temperature.\" \/>\n\t<meta name=\"robots\" content=\"max-image-preview:large\" \/>\n\t<link rel=\"canonical\" href=\"https:\/\/innovationspace.ansys.com\/forum\/forums\/reply\/186242\/\" \/>\n\t<meta name=\"generator\" content=\"All in One SEO (AIOSEO) 4.9.10\" \/>\n\t\t<meta property=\"og:locale\" content=\"en_US\" \/>\n\t\t<meta property=\"og:site_name\" content=\"Ansys Learning Forum | Ansys Innovation Space\" \/>\n\t\t<meta property=\"og:type\" content=\"article\" \/>\n\t\t<meta property=\"og:title\" content=\"Reply To: How to realistically model PCB warpage? | Ansys Learning Forum\" \/>\n\t\t<meta property=\"og:description\" content=\"To get a different solution you need to have a property that produces nonrecoverable strain such as plasticity or creep. It might also be possible to model the reflow condition with the &quot;Birth and Death&quot; feature by &quot;killing&quot; the solder material at high temperature.\" \/>\n\t\t<meta property=\"og:url\" content=\"https:\/\/innovationspace.ansys.com\/forum\/forums\/reply\/186242\/\" \/>\n\t\t<meta property=\"article:published_time\" content=\"2021-07-29T15:51:07+00:00\" \/>\n\t\t<meta property=\"article:modified_time\" content=\"2021-07-29T15:51:07+00:00\" \/>\n\t\t<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n\t\t<meta name=\"twitter:title\" content=\"Reply To: How to realistically model PCB warpage? | Ansys Learning Forum\" \/>\n\t\t<meta name=\"twitter:description\" content=\"To get a different solution you need to have a property that produces nonrecoverable strain such as plasticity or creep. 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