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Ansys Learning Forum › Forums › Discuss Simulation › General Mechanical › Vibration simulation analysis for chemical mechanical polishing (CMP) process › Reply To: Vibration simulation analysis for chemical mechanical polishing (CMP) process

November 19, 2024 at 5:38 am
m113020070
Subscriber

Hello, thank you very much for your reply.

I would like to apply a vibrational load to the main spindle of a wafer rotation system. There is a grinding wheel on the spindle that contacts the wafer surface with a downward force of 2N. I hope to obtain the stress changes in the wafer.

Thank you for your assistance.