Reply To: Vibration simulation analysis for chemical mechanical polishing (CMP) process

[m113020070]

Hello, thank you very much for your reply.

I would like to apply a vibrational load to the main spindle of a wafer rotation system. There is a grinding wheel on the spindle that contacts the wafer surface with a downward force of 2N. I hope to obtain the stress changes in the wafer.

Thank you for your assistance.