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Ansys Learning Forum › Forums › Discuss Simulation › General Mechanical › Wafer rotation deformation › Reply To: Wafer rotation deformation

May 4, 2024 at 8:30 am
m113020070
Subscriber

Dear Dave Looman,

I want to add random vibration load during the wafer grinding process and analyze the stress distribution on the wafer, but I encountered problems during the pure grinding process. I have thought about using the ls-dyna module before. Analysis, but there seems to be no way to increase the random vibration load.

Is there any recommended way for me to conduct simulation analysis?

Thank you for your time and consideration.

Sincerely,
Qian