Reliability Challenges and Checks

In this lesson on “On-die Power Integrity,” we will cover the concept of reliability in System on a Chip (SoC), and its significance in the functionality of everyday devices. The lesson starts by introducing the concept of reliability and then delves into factors affecting the reliability of a chip, such as electromigration and electrostatic discharge (ESD). The lesson uses the analogy of a mobile phone and a water supply system to explain these concepts. It then discusses various techniques to mitigate reliability issues in SoC, including increasing the width of the metal, providing multiple paths for current, metal stacking, and via array, and Blech length. The lesson also introduces the concept of Electrostatic Discharge (ESD) and explains how an ESD event can damage a chip. Finally, the lesson discusses the need for primary and secondary protection against ESD events.

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