Thermal Integrity Challenges in Multi-Die Systems — Lesson 6

In this lesson on “Thermal Integrity Challenges in Multi-Die Systems”, we will explore the critical challenges of managing heat in increasingly complex, vertically stacked semiconductor designs. First, we’ll cover the fundamentals of thermodynamics, including conduction, convection, and radiation, and their impact on heat behavior in electronic systems. Next, we’ll examine thermal integrity challenges at various scales, from device-level considerations like self-heating in transistors to multi-die systems where stacked dies create complex heat flow paths. Finally, we’ll apply these concepts to a case study of a 3DIC High-Bandwidth Memory (HBM) system, using advanced thermal simulations and mesh resolution techniques to identify hotspots and optimize performance and reliability. This course highlights the importance of multi-scale thermal design and modeling for ensuring robust 3DIC systems.

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