Introduction to Multi-Die Standard Languages — Lesson 9

In this lesson on the “Introduction to Multi-Die Standard Languages”, we will explore how standardized frameworks simplify the design and analysis of Multi-Die integrated circuits. As Multi-Die designs grow more complex, involving stacked active and passive dies connected by advanced technologies like RDL, TIV, and TSV, managing these systems across teams and tools has become challenging. Collaboration often suffers due to fragmented processes and incompatible formats.

The Multi-Die Standard Language addresses these issues by providing a unified framework for seamless data sharing, multiphysics simulation, and alignment across EDA tools, foundries, and teams. This ensures efficient, scalable, and error-free Multi-Die design. Two key languages lead the way: 3Dblox (under IEEE P3537, developed by TSMC) and 3DCODE (developed by Samsung). In the next section, we’ll dive deeper into these languages and their transformative impact on Multi-Die designs.

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3Dblox is a standardized Multi-Die design language by TSMC that simplifies complex designs using modular chiplets. Like LEGO blocks, chiplets are defined by size, interfaces, and placement, enabling efficient stacking and connectivity.

The following video includes key features such as modularization, top-down design, reuse, and interoperability across tools, reducing design time and effort. 3Dblox supports applications like PDN, thermal analysis, and DRC, streamlining workflows and enabling seamless collaboration across EDA vendors. It ensures faster, error-free Multi-Die design and analysis, saving time and costs.

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3DCODE, developed by Samsung Foundry, is a modular Multi-Die design language that simplifies the creation and analysis of Multi-Die systems. It uses a three-part structure: 3dBlock for defining individual dies, 3dBuilder for connections and stacking, and 3dTop for system-wide integration.

3DCODE enables early analysis for thermal and static IR, reducing turnaround time and costs while improving performance and reliability. With its easy-to-learn syntax, designers can quickly customize and optimize Multi-Die designs across EDA tools.

The following video includes an overview of 3DCODE, its structure, benefits, and how it streamlines Multi-Die design workflows. Next, we’ll explore Synopsys’ solution for simplifying Multi-Die integration using standardized languages.

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